| abstract |
PROBLEM TO BE SOLVED: To provide an image pickup element in which a photoelectric conversion unit is arranged on or above a semiconductor substrate, and to drive an image pickup element, a stacked image pickup device, a solid-state image pickup device, and a solid-state image pickup device which suppress deterioration of image quality. To do. An imaging element includes a photoelectric conversion unit in which a first electrode 11, a photoelectric conversion layer, and a second electrode 16 are laminated. The photoelectric conversion unit further includes a charge storage electrode 12 arranged apart from the first electrode 11 and facing the photoelectric conversion layer via an insulating layer 82. The photoelectric conversion layer has a laminated layer structure of a lower semiconductor layer 15A and an upper photoelectric conversion layer 15B from the first electrode side. FIG. 46. |