http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020181094-A

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filingDate 2019-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53829dcc97631746bbe0ab41b6c11e07
publicationDate 2020-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020181094-A
titleOfInvention Electronic devices and their manufacturing methods
abstract PROBLEM TO BE SOLVED: To improve the sealing property of an electronic device having a structure for sealing an object to be sealed. An electronic device 1 includes a first substrate 2, a second substrate 3, an enclosed body 4 sealed between the first substrate 2 and the second substrate 3, and a first substrate 2. A first sealing portion 5 for joining the second substrate 3 and a second sealing portion 6 for joining the first substrate 2 and the second substrate 3 outside the first sealing portion 5 are provided. The second sealing portion 6 includes glass. [Selection diagram] Fig. 2
priorityDate 2019-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.