http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020180190-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 |
| filingDate | 2019-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f870b2e96757d40c12be160dcc127a1 |
| publicationDate | 2020-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020180190-A |
| titleOfInvention | Thermally conductive silicone composition and its manufacturing method |
| abstract | PROBLEM TO BE SOLVED: To provide a thermally conductive silicone composition having good coating performance, low viscosity, and excellent displacement resistance, and a method for producing the same. SOLUTION: (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane are bonded to a silicon atom in a component (A) and a component (B). Organopolysiloxane, which is a reaction product reacted at a molar ratio (Si—H / Si—Vi) of 3.0 to 10.0 with the Si—H group inside. (C) Metal oxides with an average particle size of 3 μm or less, (D) Metal oxides with an average particle size of 5 μm or more, A thermally conductive silicone composition containing (E) a hydrolyzable organosiloxane having an alkoxy group and (F) water. [Selection diagram] None |
| priorityDate | 2019-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 101.