http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020176175-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eece3f4c4266dfce4fc469ddcb3eb4e9 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 |
filingDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ff5d657f73988cc5d6b59fec7e654371 |
publicationDate | 2020-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2020176175-A |
titleOfInvention | Curable resin composition |
abstract | PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a cured product having excellent heat resistance and light resistance. SOLUTION: An organopolysiloxane (A) having an alkenyl group bonded to a silicon atom and Organopolysiloxane (B) having a hydrogen group bonded to a silicon atom, Hydrosilylation catalyst (C) and Contains an organometallic compound (D) containing copper, A curable resin composition in which the content of the organometallic compound (D) with respect to the total mass of the organopolysiloxane (A) and the organopolysiloxane (B) is 1 to 1000 ppm in terms of metal elements. [Selection diagram] None |
priorityDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 132.