| abstract |
PROBLEM TO BE SOLVED: To provide a gold-coated silver bonding wire capable of suppressing a short circuit or the like due to ion migration between ball compression portions. A gold-coated silver bonding wire 1 has a core material 2 containing silver as a main component, and a coating layer 3 provided on the surface of the core material 2 and containing gold as a main component. The gold-coated silver bonding wire 1 contains gold in the range of 2% by mass or more and 7% by mass or less, and is composed of sulfur, selenium, and tellur in the range of 1% by mass or more and 80% by mass or less with respect to the total amount of the wire. Contains at least one sulfur group element of choice. [Selection diagram] Fig. 1 |