http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020174083-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2019-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ec7abdd98477d7ae3a59f3191821381
publicationDate 2020-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020174083-A
titleOfInvention Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
abstract PROBLEM TO BE SOLVED: To provide an aqueous dispersion for chemical mechanical polishing capable of efficiently polishing a substrate containing tungsten and suppressing the occurrence of corrosion on the surface of tungsten after polishing, and a chemical mechanical polishing method using the same. An aqueous dispersion for chemical mechanical polishing according to the present invention is an aqueous dispersion for chemical mechanical polishing used for a substrate containing tungsten, and is (A) abrasive grains and (B) aluminum ions and barium ions. It contains at least one selected from the group consisting of (C) oxidizing agent. [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023085009-A1
priorityDate 2019-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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