abstract |
PROBLEM TO BE SOLVED: To provide a composition for a film which gives a film having a low dielectric constant and high heat dissipation. SOLUTION: The composition for a low dielectric radiation film contains (A1) a maleimide resin containing at least two or more maleimide groups in one molecule, and (A2) a maleimide resin composition containing a polymerization initiator. And (B) boron nitride particles are included. Here, the maleimide equivalent of the component (A1) is 0.1 mol / 100 g or less, and the relative permittivity of the cured product of the component (A1) at a frequency of 10 GHz or less is 3.5 or less. [Selection diagram] None |