| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d039a29555c238166ff2126d6f0e97ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D65-40 |
| filingDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62ffba7e1e93c87714536a6dea2b7829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40f60b437bd16dd0e054cbd31d2f3a3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5d676b6a6bf5405bfe57ffe6629e901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f550867781b8184531c503fe5600cf1c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac3e30357904c85bbb7b96db2be23933 |
| publicationDate |
2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020158159-A |
| titleOfInvention |
Packaging materials, laminates, and resin molded containers |
| abstract |
PROBLEM TO BE SOLVED: To provide a packaging material which suppresses thermal runaway even when the weight of a container is light and the surface temperature of the container does not easily rise even when thermal runaway occurs. SOLUTION: The packaging material of the present invention comprises an endothermic resin composition containing a resin and an endothermic agent having a thermal decomposition start temperature of 500 ° C. or less and an endothermic amount of 500 J / g or more, and contains an endothermic agent. The amount is 15 to 85% by mass based on the total amount of the endothermic resin composition, and the amount of heat absorption in the entire endothermic resin composition is 250 J / g or more. [Selection diagram] None |
| priorityDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |