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filingDate 2019-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f799c3ee0b30ef700f64b64c81c3c01
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publicationDate 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020155544-A
titleOfInvention Manufacturing method of joint and manufacturing method of insulated circuit board
abstract PROBLEM TO BE SOLVED: To produce a good bonded body by uniformly pressing the laminated body when joining a laminated body of a plurality of different materials in a pressurized and heated state. SOLUTION: The production of a bonded body in which a first metal plate and a second metal plate are laminated and the laminated body is pressurized and heated in a state where a spacer is in contact with the surface of at least one side of the laminated body. In the method, the spacer is provided with a metal foil made of a material that does not react with the surface of the laminate when heated on the contact surface side with the laminate, and the Vickers hardness and thickness (mm) of the metal foil are different. The product is 10 or less. [Selection diagram] Fig. 3
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