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publicationDate 2020-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020145244-A
titleOfInvention Semiconductor device manufacturing methods, substrate processing devices and programs
abstract PROBLEM TO BE SOLVED: To control stress of a film formed on a substrate. SOLUTION: Under a first temperature, a step of supplying a raw material containing a cyclic structure composed of silicon and carbon and halogen to a substrate, and a step of supplying a nitride to the substrate. By performing the non-simultaneous cycle of the above a predetermined number of times, a step of forming a first film containing a cyclic structure and nitrogen on the substrate and (b) supplying an oxidizing agent to the substrate under a second temperature. The third film in (c) has a step of converting the first film into a second film containing a cyclic structure and oxygen, and (c) a step of annealing the second film under a third temperature. By controlling the temperature, the stress of the second membrane is controlled. [Selection diagram] Fig. 4
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