http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020132757-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 |
| filingDate | 2019-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d145a2b7122477495cec704462c233cc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_629adb3892716db8d169c30ef61285e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f0caac804979235069851d565061892 |
| publicationDate | 2020-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020132757-A |
| titleOfInvention | Silicone resin composition for die bonding, cured product and optical semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a silicone resin composition for die bonding which gives a cured product having a low refractive index, high hardness, transparency and excellent die shear strength. SOLUTION: (A) It has two or more alkenyl groups bonded to Si atoms and one or more CF 3 (CF 2 ) m (CH 2 ) n groups in one molecule, and has a viscosity of 1,000 mPa. A linear organopolysiloxane of s or less, (B) having two or more alkenyl groups bonded to a Si atom and one or more CF 3 (CF 2 ) o (CH 2 ) p groups in one molecule. Branched organopolysiloxane having Q unit and / or T unit: 60 to 90 parts by mass with respect to 100 parts by mass of the components (A) and (B), and (C) two or more SiH groups in one molecule. Organic silicon compound: The amount of SiH groups in the component (C) is 0.5 to 5.0 with respect to one alkenyl group in the components (A) and (B), and the platinum group metal (D). A silicone resin composition for die bonding, which comprises a system catalyst. [Selection diagram] None |
| priorityDate | 2019-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.