| abstract |
The present application relates to a photocurable resin composition and its use. INDUSTRIAL APPLICABILITY The present application can provide a photocurable resin composition having excellent properties such as heat resistance, adhesive strength, cohesive strength, and the like, and having an elastic modulus after temporary curing suitable for a dam and fill process. The photocurable resin composition can be effectively used as a direct bonding between optical members and a filler for an air gap. SOLUTION: A photocurable resin composition satisfying the condition of the following formula 1: [Formula 1] 40%≦S 60 /S 0 <80% In Equation 1, S 0 represents that the photocurable resin composition is irradiated with light having a wavelength of 395 nm at an intensity of 100 mW/cm 2 and a light amount of 200 mJ/cm 2 , and a shear deformation of 5% is obtained after curing. ) Is the initial stress, and S 60 is the stress after 60 seconds. [Selection diagram] Figure 1 |