http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020112398-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2019-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66be3eb98db4c5f220f88f7f5231210f |
| publicationDate | 2020-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020112398-A |
| titleOfInvention | Semiconductor device manufacturing method and socket |
| abstract | PROBLEM TO BE SOLVED: To improve the performance of a semiconductor device. A method of manufacturing a semiconductor device includes a step of preparing an object to be inspected including a plurality of external terminals ET and exposing a die pad DP from a sealing body BD, a base BS in which a plurality of terminals TA are embedded, and a plurality of bases. Process of preparing a socket SK including a ground unit GU including a probe PR, a plurality of external terminals ET are brought into contact with a plurality of terminals TA, and a die pad DP is brought into contact with a plurality of probes PR, and an electrical test is performed. And a step of performing. The base BS is made of an insulator, the terminals are electrically separated from each other, the ground unit GU is made of a metal material, and the probes PR are electrically connected to each other. ing. [Selection diagram] Fig. 6 |
| priorityDate | 2019-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.