http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020107627-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54063f3bf0907634a129e16c897d1717 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 |
| filingDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9073226ded61f691fb6243f141a15f7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fcf9ff94dbdc4fd253aa2283af58418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d38eaf6c1ede162a7ed38230b891092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18d96348c1986ecf9c6239e3eb5a68be |
| publicationDate | 2020-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020107627-A |
| titleOfInvention | Semiconductor device and method of manufacturing semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device. A semiconductor device includes a wiring board (3) having an upper surface (3a) and a lower surface (3b) opposite to the upper surface (3a), a wiring (3ab) formed on the upper surface (3a) of the wiring board, and a lower surface (3b) of the wiring board. The formed wiring 3ba, the plurality of semiconductor chips 1 mounted on the wiring 3ab via the bonding material 2, and the wiring 3ba are bonded to each other via the bonding material 5 to support the wiring board 3. 4 and. The plurality of semiconductor chips 1 are arranged at the end portion A2 of the wiring board 3 in a plan view, and the end portion A2 of the wiring board 3 of the wiring board 3 in the plan view is convex toward the upper surface 3a side. While being fixed in shape, the central portion A1 of the wiring board 3 is flat. [Selection diagram] Figure 1 |
| priorityDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.