http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020097697-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2018-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e18f861a7dffefddd5e03a1dc6717b1 |
| publicationDate | 2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020097697-A |
| titleOfInvention | Resin composition for solder resist and method for producing circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a resin composition for a solder resist capable of obtaining a high degree of opening accuracy while ensuring rigidity and insulating properties. A resin composition for a solder resist contains an epoxy resin, a cyanate resin, and a photosensitizer. [Selection diagram] None |
| priorityDate | 2018-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 188.