http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020095783-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bfefd800f38f5e22f9b809a498f78ed |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76 |
| filingDate | 2018-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9556cf1867882c27e8cfed4f8291119 |
| publicationDate | 2020-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020095783-A |
| titleOfInvention | Socket and connection structure |
| abstract | PROBLEM TO BE SOLVED: To provide a socket having a heat dissipation function capable of downsizing and cost reduction. A socket of the present invention includes a plurality of contacts, a base member 110, a stopper member 140 attached to the substrate side of the base member 110, and a guide member 150 attached to the substrate side of the stopper member 140. .. When the board-side contact portion 136 of the contact 130 protruding from the stopper member 140 is inserted into the through hole 310 of the circuit board 300, the heat dissipation portion 144 extending to the side of the stopper member 140 has the GND on the surface of the circuit board 300. The heat generated in the semiconductor package 200 by being thermally coupled to the region is radiated to the circuit board 300 via the heat radiation portion 144 and the GND region 320. [Selection diagram] |
| priorityDate | 2018-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 |
Total number of triples: 13.