http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020089896-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2018-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2345f837160082225ecc0f294c71fc6d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffa188e0c93f5e8bf986135171e238d8 |
| publicationDate | 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020089896-A |
| titleOfInvention | Flux, solder alloy, bonded body, and method for manufacturing bonded body |
| abstract | An object of the present invention is to provide a flux or the like which sufficiently improves the wettability of a solder alloy containing no Ag. SOLUTION: A chlorendic acid and/or anhydrous material for soldering a solder alloy containing 0.1 to 3.0% by weight of Cu and 0.0040 to 0.0150% by weight of Ge, and the balance of Sn. A flux containing chlorendic acid. [Selection diagram] None |
| priorityDate | 2018-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 337.