http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020088242-A

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filingDate 2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81724744c1274d30104891c72235f812
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publicationDate 2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020088242-A
titleOfInvention Electronic component and manufacturing method thereof
abstract An object of the present invention is to reduce the installation area of an electronic component and to reduce the wiring load of the electronic component. An electronic component (2) includes a magnetic body (4) having a hollow portion (13), a conductor (6) penetrating the hollow portion of the magnetic body and protruding from the hollow portion, and the conductor. And a plurality of solid electrolyte layers (16-2) formed on the surface of the dielectric layer, a plurality of solid electrolyte layers formed on the surface of the dielectric layer, and a plurality of solid electrolyte layers. The plurality of extraction layers (carbon layer 16-3, silver layer 16-4) are provided. A plurality of capacitors are formed between the plurality of solid electrolyte layers and the conductor, and the capacitance values of the plurality of capacitors are different. [Selection diagram]
priorityDate 2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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