http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020084103-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B18-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-10 |
| filingDate | 2018-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd76eb4db33d3fcaf75e3eb63109a32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_741de79b22a8f9ec086ec481baf0fb69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_111b6b0ef44e9d7e80517a978e93f9ae |
| publicationDate | 2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020084103-A |
| titleOfInvention | Resin composition, adhesive sheet and multilayer substrate |
| abstract | PROBLEM TO BE SOLVED: To adhere to a metal such as copper by lowering the dielectric constant and dielectric loss tangent while imparting sufficient heat resistance and mechanical strength of polyimide and imparting thermosetting property to lower the melt viscosity during heating. Provided is a resin composition having improved strength and processability. A resin composition containing at least (A) a polyimide resin and (B) an epoxy resin, wherein the (B) epoxy resin is at least (B-1) an epoxy resin having an alkyl group having 9 or more carbon atoms. And a content of (B-1) is 30% by mass or more and 70% by mass or less based on the whole (B) epoxy resin. [Selection diagram] None |
| priorityDate | 2018-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 162.