http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020082106-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2018-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a65dc840d1bc8dd752f9fe3577e06d7c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f72c5de3df8812a8ab0783b145b2f31b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9d3d6b8446693405d7af8fa955deb1f |
| publicationDate | 2020-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020082106-A |
| titleOfInvention | Residual flux composition and solder paste |
| abstract | PROBLEM TO BE SOLVED: To provide a residue-free flux composition and a solder paste capable of reducing the flux residue remaining after soldering and exhibiting good wettability of the solder paste. A residue-free flux composition comprising an organic compound (A), a solvent (B), an activator (C), and a thixotropic agent (D), The activator (C) contains an organic acid (C-1) having 3 to 5 carbon atoms and a halogen compound (C-2), The amount of the organic acid (C-1) having 3 to 5 carbon atoms is 0.1% by mass or more and 1.5% by mass or less based on the total amount of the residue-free flux composition, The residue-free flux composition, wherein the amount of the halogen compound (C-2) is 0.01% by mass or more and 0.1% by mass or less based on the total amount of the residue-free flux composition. [Selection diagram] Figure 1 |
| priorityDate | 2018-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.