| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3fe06a0b8fc5aced2f3945950c415eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09842aaefa0d21c1f81f2a61aa2bfe8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2bd064e7e53f1c498b331160ec80394 |
| publicationDate |
2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020063387-A |
| titleOfInvention |
Sealing resin composition and electronic component device |
| abstract |
PROBLEM TO BE SOLVED: To provide a sealing resin composition having excellent heat resistance after curing and an electronic component device having excellent heat resistance. SOLUTION: The encapsulating resin composition contains an epoxy resin and a curing agent, and the epoxy resin contains a phenol novolac type epoxy resin. [Selection diagram] None |
| priorityDate |
2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |