| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19b5c6093f8859d3e6bf9237df2eb5b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b060a10c591367b8547cd73b851831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55b712e478693cfd32dee0492cded009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61b56fa39f9e5bda14df408ec27a07e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_206e264be9a2d54b3096dd493bdb89e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a22a96b208fcc1a47abc17188a27bc1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e4a1bd15e426cd0566691f47a400d01 |
| publicationDate |
2020-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020057799-A |
| titleOfInvention |
Printed wiring board substrate, printed wiring board, method for manufacturing printed wiring board, and method for manufacturing printed wiring board |
| abstract |
Provided are a printed wiring board substrate, a method of manufacturing a resin base material, and a method of manufacturing a printed wiring board, capable of forming a fine conductive pattern while maintaining the adhesion between a conductive layer and a base film. A printed wiring board substrate includes a base film having an insulating property, and a conductive layer laminated on at least one surface of the base film. The maximum height Sz defined by ISO25178 of the base film surface is 0.05 μm or more and less than 0.9 μm, and the contact angle of the exposed base film surface with pure water is 4 ° or more and 60 ° or less; And the mass ratio of chromium near the interface of the conductive layer is 100 ppm or less. The conductive layer is formed by applying and heating a conductive ink containing metal particles. [Selection diagram] Fig. 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022075239-A1 |
| priorityDate |
2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |