abstract |
An object of the present invention is to provide a cured film excellent in chemical resistance and flexibility even when cured at a low temperature of about 220 ° C., which is excellent in developability of an exposed portion and is used as an insulating film for rewiring. Provided are a photosensitive resin composition suitable for use, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and an electronic component having the cured product. SOLUTION: The composition contains (A) a polybenzoxazole precursor, (B) a photosensitizer, (C) an epoxy compound having two or more functionalities, and (D) a plasticizer having no self-polymerizable group. And the like. [Selection diagram] None |