http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020045558-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ac98d5f88056fe73f2c9795f2916cd0 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate | 2019-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71cf7cb2035e0eebdcdca590a99f1555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b4a3501b06a10ea060b2dee6acb0a15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_550ac8d390ecf42193b21971c9c87dd1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aa9641f8fc97ac91f24a707e4cc466f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_598f92cd5232de8e4a4d60227d22bcd2 |
| publicationDate | 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020045558-A |
| titleOfInvention | Substitution type electroless gold plating solution containing purine or pyrimidine compound having carbonyl oxygen and substitution type electroless gold plating method using the same |
| abstract | Provided is a replacement type electroless gold plating solution that can prevent a local erosion phenomenon on a copper surface, which is a fatal defect when copper wiring of a printed circuit board is directly electrolessly plated. Kind Code: A1 A purine or pyrimidine compound having carbonyl oxygen as a local erosion blocker, a water-soluble gold compound, an aminocarboxylic acid as a complexing agent, a dicarboxylic acid as a conductivity improver, a base metal dissolution inhibitor and a reprecipitation inhibitor. α-hydroxycarboxylic acid and heteroarylcarboxylic acid, a sulfite compound as a gold ion stabilizer, an azole compound as a surface corrosion inhibitor, other surfactants, a crystal modifier, a pH adjuster, a substitution type containing a buffer. Electroless gold plating solution of electrolytic gold plating method and gold plating method using the same. The substitutional electroless gold plating solution of the present invention prevents local erosion on the surface of the copper as the underlying metal, so that the manufactured gold plating film has excellent solder mounting reliability. [Selection diagram] Fig. 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113005437-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113005437-B |
| priorityDate | 2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 283.