Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 |
filingDate |
2018-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b210b94bf87ed39913830efb06f0c06a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a690dbe5018b4edbf8b71b3b2c3f8e1e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_536840db547ed8f112ca5aea82418992 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_371cb2fb091d7a9086d4728cbfa33d71 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46873376974dfde7bdb3304c146f1887 |
publicationDate |
2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2020045403-A |
titleOfInvention |
Curable resin composition, cured body, electronic parts and assembled parts |
abstract |
An object of the present invention is to improve initial adhesion when temporarily bonding using a curable resin composition. The curable resin composition of the present invention comprises at least one type of curing selected from the group consisting of a photocurable resin (A), a moisture curable resin (B1), and a thermosetting resin (B2). Curable resin composition containing a curable resin (B), A cured product of the curable resin composition cured under irradiation conditions of a light intensity of 1000 mJ / cm 2 and a wavelength of 365 nm has a storage elastic modulus at 25 ° C. of 1 kPa or more and 1 MPa or less, and has a tack value of 10 g. / Mm 2 or more. [Selection diagram] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115135676-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021230373-A1 |
priorityDate |
2018-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |