| abstract |
To provide a resin composition for an insulating layer, which has a low dielectric loss tangent, suppresses swelling during heat curing, and has a reduced surface roughness after a roughening treatment, and a resin composition for the insulating layer. Provided are a sheet-like laminated material containing an article, a multilayer printed wiring board obtained by using the sheet-shaped laminated material, and a semiconductor device including the multilayer printed wiring board. A resin composition for an insulating layer containing (A) a liquid epoxy compound, (B) a solid epoxy resin, (C) an active ester curing agent, and (D) an inorganic filler. [Selection diagram] None |