| abstract |
A resin material capable of suppressing occurrence of undulation is provided. A resin material according to the present invention includes an epoxy compound, an inorganic filler, and a curing agent, wherein the curing agent includes a first curing agent represented by the following formula (1): In a total of 100% by weight of the curing agent, the content of the first curing agent is 40% by weight or less. Embedded image In the formula (1), R1, R2 and R3 each represent an organic group having an aromatic skeleton, and in the formula (1), the number of ester bonds is 3 or less. [Selection diagram] Fig. 1 |