abstract |
An object of the present invention is to provide a thermosetting light-reflecting resin composition which has high reflectance from visible light to near ultraviolet light after curing, has excellent heat deterioration resistance and tablet moldability, and hardly generates burrs during transfer molding. (A ') An epoxy containing at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, diglycidyl isocyanurate, and triglycidyl isocyanurate. An oligomer of a resin and a curing agent containing at least one selected from the group consisting of (B ′) an acid anhydride curing agent, an isocyanuric acid derivative, and a phenolic curing agent, and alumina, magnesium oxide, antimony oxide, and oxide A thermosetting resin composition for light reflection, comprising a white pigment containing at least one selected from the group consisting of titanium, zirconium oxide, and inorganic hollow particles. [Selection diagram] Fig. 1 |