abstract |
An object of the present invention is to provide a photosensitive adhesive composition that can be bonded at a lower temperature. A photosensitive adhesive composition for forming a film according to the present invention comprises a polymer containing a structural unit derived from a cyclic olefin in a molecule, a photosensitive agent, and a phenoxy resin, and a weight average molecular weight of the phenoxy resin. Mw is 1,000 or more and 10,000 or less. [Selection diagram] Fig. 1 |