http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020016876-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38 |
| filingDate | 2019-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_164dc69fc7a29d8ef9a68fac4f41772f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd6b9d0f9c4f086cca5768a6f099a6ac |
| publicationDate | 2020-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020016876-A |
| titleOfInvention | Chemically amplified positive photosensitive resin composition, method for producing substrate with mold, and method for producing plated object |
| abstract | The present invention relates to a chemically amplified positive photosensitive resin composition capable of suppressing adhesion of residue of a mold to a plated model when a mold is removed after the formation of a plated model, and a chemically amplified positive photosensitive resin. Provided are a method for producing a substrate with a mold using a composition, and a method for producing a plated molded article using the chemically amplified positive photosensitive resin composition. SOLUTION: A chemically amplified positive photosensitive resin composition containing a predetermined component containing a predetermined amount of an organic solvent (S1) having a boiling point of 120 to 180 ° C. and satisfying the following [Requirement 1] is used. [Requirement 1] The residual ratio of the solvent measured by the following steps 1) and 2) is 3.5% by mass or less. 1) A coating of 40 μm is formed by applying a chemically amplified positive photosensitive resin composition to a substrate. 2) Bake at a temperature 10 ° C. higher than the boiling point of the organic solvent (S1) for 30 seconds, and calculate the ratio of the organic solvent (S1) to the total mass of the baked coating film by GC (gas chromatography). [Selection diagram] None |
| priorityDate | 2019-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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