http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020006402-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_970db33120da054de157f6421a736ad4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2018-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a64e9ceda5842e19777bbcc308889f41 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f90ad64bb7010e5bcebe2544b60cdc38 |
| publicationDate | 2020-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2020006402-A |
| titleOfInvention | Low residue solder paste |
| abstract | An object of the present invention is to provide a solder paste flux in which the amount of flux residue after soldering is extremely small, and a solder paste containing the flux. The present invention reduces the amount of flux remaining after soldering by minimizing the content of a thixotropic agent or the like for preventing the sedimentation of solder powder in a solder paste and using urea urethane as an antisedimentation agent. And succeeded in significantly reducing the flux residue after soldering. [Selection figure] nothing |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114986019-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114986019-B |
| priorityDate | 2018-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.