Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2018-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50f28ae78ece3fd779cb7e0ddf5d9a7e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c97f487624edd0f797a809bae40b00f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_023026369187e65a404c07cb1026b3f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0ed1d6d7dc9c9930d809cd38573a7b8 |
publicationDate |
2020-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2020002187-A |
titleOfInvention |
Epoxy resin composition and liquid crystal sealant, adhesive, underfill and die bond paste containing the same |
abstract |
An object of the present invention is to provide a thermosetting resin composition excellent in low viscosity. An epoxy resin composition comprising (A) an epoxy resin and (B) a spherical latent curing agent having a particle diameter (D50) of 0.5 μm to 10 μm and an average circularity of 0.95 or more. And a liquid crystal sealant, an adhesive, an underfill and a die bond paste containing the same. [Selection diagram] Fig. 1 |
priorityDate |
2018-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |