| abstract |
A method for manufacturing a printed circuit board, comprising: (i) a copper circuit having a copper surface on at least one surface, wherein the copper surface is (a) an oxidation and subsequent reduction reaction and / or ( b) a copper circuit chemically treated with an organic compound deposited on the copper surface, and a permanent, non-conductive, non-polymerized coating that at least partially covers the copper surface. Providing a non-conductive substrate having a layer, and (ii) in an atmosphere containing molecular oxygen in an amount of 100000 ppm or less, based on the total volume of the atmosphere, at a temperature in the range of 40 ° C. to 250 ° C., Heat treating a substrate having a permanent, non-conductive, non-polymerized coating layer, whereby a substrate having a permanent, non-conductive coating layer is obtained, the coating layer Is And a step that is more polymerized as compared to the flop (i) in that order, method. |