| abstract |
The present disclosure relates to the field of electronic communications. A housing, as well as its manufacturing method and its application are disclosed. The housing includes a metal anodic oxide layer (5) and a resin film layer (3) attached to the first surface of the metal anodic oxide layer (5). The metal anodic oxide layer (5) and the resin film layer (3) have an integral structure. The manufacturing method includes the steps of performing anodization on the metal substrate (1), followed by injection molding and etching. |