| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79776401f9c7633d6b364e2f0c1ba07e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63e430f7e346a90f745185aae1a56b2f |
| publicationDate |
2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019220614-A |
| titleOfInvention |
Semiconductor device and method of manufacturing semiconductor device |
| abstract |
Provided is a semiconductor device having excellent heat dissipation properties and an effect of suppressing electromagnetic waves. In order to solve the above problem, a semiconductor device according to the present invention includes a semiconductor element, a conductive shield can having a cylindrical shape provided to surround a side surface of the semiconductor element, and A conductive cooling member, and a conductive heat conductive sheet formed between the semiconductor element and the cooling member, wherein the conductive shield can and the cooling member are electrically conductive. It is electrically connected via the conductive heat conductive sheet 10. [Selection diagram] Fig. 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021111739-A1 |
| priorityDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |