| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2019-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64b9001d74dffb85dc50f6e99a69cd52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57520725a52b3190fbc9cafd6aad4e50 |
| publicationDate |
2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019218629-A |
| titleOfInvention |
Composition for electroless copper plating and method for electroless plating copper on a substrate |
| abstract |
PROBLEM TO BE SOLVED: To provide a composition for electroless copper plating and a method for electroless plating copper on a substrate. SOLUTION: A stable electroless copper plating bath contains a dication viologen compound for improving a copper deposition rate on a substrate. Copper from the electroless plating bath can be plated at low temperatures and high plating rates. [Selection diagram] Fig. 1 |
| priorityDate |
2018-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |