abstract |
A composition for electroless copper plating and a method for electroless plating copper on a substrate, which enables a high electroless plating rate at a low temperature and gives a bright and homogeneous copper deposit on the substrate. Provide a method. One or more copper ion sources, one or more imidazolium compounds, one or more complexing agents, one or more reducing agents, and optionally one or more pH controls A composition for electroless copper plating, comprising an agent, wherein the pH of the composition is greater than 7. [Selection diagram] None |