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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B27N3-04
filingDate 2018-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76b62ade39820e47647177d227e1f809
publicationDate 2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019217728-A
titleOfInvention Thin insulation board and its manufacturing method
abstract An object of the present invention is to provide a thin insulation board which is reduced in weight and is suitable as a curing material. A thin insulation board (1) includes an insulation board body (2) having a thickness of less than 3 to 6 mm, and a water-based resin liquid applied coagulation layer (5) applied to one surface of the insulation board body (2). Be composed. Since the aqueous resin liquid is thermoplastic, the applied cohesive layer 5 does not lose its properties as an insulation board, and when used as a curing material even if it is thin, has excellent protection against local impact and protection against sand biting. Demonstrate the nature. [Selection diagram] Fig. 1
priorityDate 2018-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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