Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
filingDate |
2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f96614396edc0b821ef28c9a3a25c2d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7741df1fdbd45bda98c995beefc0edce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5460140bf854c48093de21207562412 |
publicationDate |
2019-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2019211669-A |
titleOfInvention |
Resin composition, cured film, pattern cured film manufacturing method, semiconductor element, and electronic device |
abstract |
[PROBLEMS] To provide a resin composition capable of forming a cured film having excellent storage stability at room temperature and excellent adhesion to copper. The resin composition of the present invention contains (A) an alkali-soluble resin, (B) a silane coupling agent having a hindered amine skeleton, and (C) a thermal crosslinking agent. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7354950-B2 |
priorityDate |
2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |