| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_75aa4769c1e6d8483bc818c8fad14ad7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2019-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb5bd41ab7d5a9ef5b6749854389d072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64ddc0f0142c0d189875ba2e7f047212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c13d236f0afd82b24b7e1ef7fcccc7fa |
| publicationDate |
2019-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019210461-A |
| titleOfInvention |
Polishing slurry composition |
| abstract |
A polishing slurry composition comprising iron-substituted abrasive particles capable of improving the surface planarization process of a thin film applied to a semiconductor element and a display element is provided. A polishing slurry composition comprising iron-substituted abrasive particles, a pH adjusting agent, a chelating agent, an oxidizing agent, or both. The polishing slurry composition, wherein the iron-substituted abrasive particles are contained in an amount of 0.0001 to 20 parts by weight with respect to the slurry composition. [Selection] Figure 1 |
| priorityDate |
2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |