| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12bc5b00c78815f2dd10b721001423d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f1ed54832b5cf422a2565f9c0bfd88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e |
| publicationDate |
2019-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019207934-A |
| titleOfInvention |
Back adhesion film and dicing tape integrated back adhesion film |
| abstract |
[PROBLEMS] Suitable for enabling inspection of a chip by observation with an infrared microscope from the back surface side of the chip in a state of being adhered to the back surface of the semiconductor chip while ensuring good infrared shielding properties and laser mark properties. A back adhesion film is provided. Moreover, a dicing tape integrated back contact film provided with such a back contact film is provided. A film, which is a back contact film of the present invention, contains a plurality of light-absorbing components each having an absorption maximum at different wavelengths in the visible and near-infrared wavelength regions. The value of the ratio of the total light transmittance of the light of 1000 nm wavelength measured for the sample piece to the total light transmittance of the light of wavelength 1800 nm measured for the film sample piece of thickness 25 μm prepared from the film 10 Is 1.2 or more. The dicing tape back contact film X of the present invention includes the dicing tape 20 and the film 10 that is in close contact with the adhesive layer 22 so as to be peeled off. [Selection] Figure 1 |
| priorityDate |
2018-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |