http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019201177-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a6244f8e7f8e355464f3664873746f1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate | 2018-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_933e49d419729eb4026564994ada88be http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85cc3f3f48977465c197dbaf43b17b56 |
| publicationDate | 2019-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019201177-A |
| titleOfInvention | Polishing pad and manufacturing method thereof |
| abstract | Disclosed is a polishing pad for polishing various devices such as a semiconductor substrate, a semiconductor device, a compound semiconductor substrate, a compound semiconductor device and the like, and a polishing pad capable of uniformly polishing the surface of an object to be polished, and a method for manufacturing the same. It is in. A polishing pad comprising an ultrafine fiber having a fiber diameter of 10 to 2500 nm, a binder fiber, and a polymer elastic body, and a polishing pad sinking amount defined below within a range of 100 to 400 μm. is there. [Selection figure] None |
| priorityDate | 2018-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.