| abstract |
A resin composition capable of obtaining a cured product having excellent smear removability and excellent adhesion to a conductor layer; a resin sheet containing the resin composition; formed using the resin composition A printed wiring board provided with an insulating layer; and a semiconductor device. A resin composition comprising (A) an epoxy resin, (B) a benzoxazine-based curing agent, and (C) (meth) acrylic acid ester, wherein the mass of the component (B) is benzoxazine ring equivalent A resin composition in which b / c is 0.08 or more and 2.5 or less, where b is the value divided by x and c is the value obtained by dividing the mass of component (C) by the (meth) acryloyl group equivalent. [Selection figure] None |