http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019181803-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b657bae7c6ba14f228fefd2393ecc834 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0ce768cf09605b0f9e53285ce27c339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38d11072b153e097230ec54a1165df5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5425e7510520250dd051628018208502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93623cc9aa1c831638033696e2111b82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2205932827a7c26cc9f1acdc03d5dea |
| publicationDate | 2019-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019181803-A |
| titleOfInvention | LAMINATE, ITS MANUFACTURING METHOD, COATING LIQUID, PRINTED BOARD MANUFACTURING METHOD |
| abstract | [PROBLEMS] To provide excellent electrical characteristics, support for frequencies in the high frequency band, metal layer is difficult to oxidize during manufacturing, and excellent adhesion between a cured product layer and a metal layer, prepreg, etc. without using special high-temperature equipment. And a manufacturing method thereof, a coating solution used for manufacturing the stacked body, and a method for manufacturing a printed circuit board. A cured product layer containing a cured product of a fluororesin, and a metal layer provided on one or both sides of the cured product layer and having a surface roughness Rz of 4.5 μm or less in contact with the cured product layer A laminate comprising: Furthermore, the laminated body by which the fiber reinforced resin layer is joined to the surface on the opposite side to the said metal layer of the said hardened | cured material layer. A method of manufacturing a printed circuit board, wherein a patterned circuit is formed by etching a metal layer of the laminate to obtain a printed circuit board. [Selection figure] None |
| priorityDate | 2018-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 94.