| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2019-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5ced2fa75843a8c1ea00bdff82516d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f7305b3f785d6be63405ccda474a9e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b18eb0917c2843451df5303e30acd23 |
| publicationDate |
2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019176146-A |
| titleOfInvention |
Method for manufacturing component-embedded substrate, component-embedded substrate, adhesive sheet, and resin composition |
| abstract |
A component-embedded substrate manufacturing method for manufacturing a component-embedded substrate having at least an interlayer insulating layer and electronic components (13a, 13b) disposed on one surface of the interlayer insulating layer, wherein at least an adhesive layer (3a) is provided. An adhesive sheet preparing step for preparing the adhesive sheet 1 to be included, a temporary fixing step for temporarily fixing an electronic component to the adhesive layer of the adhesive sheet, and a curing step for curing the adhesive layer to form the interlayer insulating layer 3b. The adhesive layer contains a resin composition. The resin composition has a resin flow rate of 80% or more, and the cured product after curing has a glass transition temperature of 175 ° C. or more. [Effect] It is possible to reduce the generation of voids when electronic components are mounted on an adhesive sheet. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023054677-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7239076-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022239471-A1 |
| priorityDate |
2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |