http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019175898-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2018-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f43254e347c1d262ddcf081e48c3e77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cb05e63e877da949332d24d258abeb7 |
| publicationDate | 2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019175898-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | A semiconductor device manufacturing method capable of manufacturing a semiconductor device with a reduced fillet width is provided. A method of manufacturing a semiconductor device in which respective connection portions of a semiconductor chip and a printed circuit board or another semiconductor chip are electrically connected to each other, wherein a photocurable resin and / or light is applied to the semiconductor wafer. Affixing process for affixing a semiconductor adhesive containing a polymerization initiator, a supporting process for supporting a semiconductor wafer affixed with a semiconductor adhesive on a dicing tape, and dicing and adhering the semiconductor adhesive and the semiconductor wafer A dicing step for forming a semiconductor chip with an adhesive, a light irradiation step for irradiating ultraviolet rays from the dicing tape side to a laminate in which a plurality of semiconductor chips with an adhesive are carried on a dicing tape, and a semiconductor chip with an adhesive A crimping step of picking up from a dicing tape and crimping to a printed circuit board or another semiconductor chip. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023058481-A1 |
| priorityDate | 2018-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.