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filingDate 2018-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c33ad5c82aa51aae0bda0c7c215420e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3603acd9ee7ec3930d0257ce652bc9bc
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publicationDate 2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019172936-A
titleOfInvention Composition for heat dissipation member, heat dissipation member, electronic device
abstract A composition and a heat radiating member capable of forming a heat radiating member having further high thermal conductivity and controllability of thermal expansion coefficient. The composition for a heat dissipation member of the present invention comprises a first coupling agent 11; a thermally conductive first inorganic filler 1 bonded to one end of the first coupling agent 11; A coupling agent 12; a thermally conductive second inorganic filler 2 bonded to one end of the second coupling agent 12, and a bifunctional or higher functional polymerizable compound bonded to the other end of the second coupling agent 12. 22 and: a third coupling agent 13; a thermally conductive third inorganic filler 3 bonded to one end of the third coupling agent 13, and the first coupling agent 11 and the polymerizable compound. 22 has groups that can be bonded to each other, the third coupling agent 13 and the polymerizable compound 22 have groups that can bond to each other, and the third inorganic filler 3 is a nitride whisker. . [Selection] Figure 1
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