http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019167583-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
filingDate 2018-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d031f99746bc0726204a4b39ef5938e
publicationDate 2019-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019167583-A
titleOfInvention Copper-clad laminate and method for producing copper-clad laminate
abstract The present invention provides a copper clad laminate having a copper plating film in which recrystallization proceeds slowly, and a method for producing the copper clad laminate. A copper-clad laminate 1 includes a base material 10 and a copper plating film 20 formed on the surface of the base material 10. The copper plating film 20 is formed by alternately laminating a low current density layer 21 formed by electrolytic plating at a low current density and a high current density layer 22 formed by electrolytic plating at a high current density. The copper-clad laminate 1 is obtained by forming a copper plating film 20 on the surface of the base material 10 by electrolytic plating using a copper plating solution containing an additive. At this time, electrolytic plating at a low current density and electrolytic plating at a high current density are alternately performed to form a copper plating film 20. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020132920-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7211184-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7230564-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020132921-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7276025-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7322678-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020152955-A
priorityDate 2018-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012057191-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009295656-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011017036-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2734041
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID33286
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID88802593
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69023
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451246904
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454103209
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449155612
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11196097
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452615738
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449022004
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID87206
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452787860
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411832067
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415782876
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID76123
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID87126089
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6451521
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452327997
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452478358
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID87217
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14452
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447981449

Total number of triples: 47.