| abstract |
The present invention provides a thermosetting resin composition that does not cause whitening when a wiring pattern is embedded in a film, a resin film for interlayer insulation using the same, a composite film, a printed wiring board, and a method for producing the same. A thermosetting resin composition comprising an epoxy resin (A), an active ester curing agent (B), a phosphorus curing accelerator (C) and a pyridine compound (D) having a tertiary amino group, The resin film for interlayer insulation using this, a composite film, a printed wiring board, and its manufacturing method. [Selection figure] None |