http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019155316-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-14 |
| filingDate | 2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45358f22d9a6fe680dd095ba5d152621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f05490f709d77ea97dfe7e986036839 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cff8ea1b5215f2dc2ad285ecaa8ebf22 |
| publicationDate | 2019-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019155316-A |
| titleOfInvention | Method for forming cured coating film |
| abstract | The object of the present invention is to prevent the photosensitive resin composition from coming out to the back side of the substrate through the through hole and to make the thickness of the coating film uniform even if the substrate has a through hole. It is to provide a method for forming a coating film. A first photosensitive resin composition having a viscosity of 150 to 1500 mPa · s at 25 ° C. is applied to at least a through hole portion of a substrate by an ink jet method to form a filling material in the through hole. A step of coating a second photosensitive resin composition on the first main surface of the substrate and the first main surface side of the filler to form a coating; and Forming a cured coating film by curing the film, and in the step of applying the first photosensitive resin composition, the substrate is a surface opposite to the first main surface of the substrate. A method of forming a cured coating film in which at least a peripheral edge portion of the through hole is non-contact among the second main surface. [Selection] Figure 1 |
| priorityDate | 2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 162.